Factory Lead Time  

12 Weeks

Contact Plating  

Tin

Mount  

Surface Mount

Mounting Type  

Surface Mount

Package / Case  

TO-252-3, DPak (2 Leads + Tab), SC-63

Number of Pins  

3

Supplier Device Package  

D-Pak

Current - Continuous Drain (Id) @ 25℃  

86A Tc

Drive Voltage (Max Rds On, Min Rds On)  

4.5V 10V

Number of Elements  

1

Power Dissipation (Max)  

75W Tc

Turn Off Delay Time  

15 ns

Operating Temperature  

-55°C~175°C TJ

Packaging  

Tape & Reel (TR)

Series  

HEXFET®

Published  

2005

Part Status  

Not For New Designs

Moisture Sensitivity Level (MSL)  

1 (Unlimited)

Max Operating Temperature  

175°C

Min Operating Temperature  

-55°C

Element Configuration  

Single

Power Dissipation  

75W

Turn On Delay Time  

12 ns

FET Type  

N-Channel

Rds On (Max) @ Id, Vgs  

5.8mOhm @ 25A, 10V

Vgs(th) (Max) @ Id  

2.35V @ 50μA

Input Capacitance (Ciss) (Max) @ Vds  

2150pF @ 15V

Gate Charge (Qg) (Max) @ Vgs  

23nC @ 4.5V

Rise Time  

49ns

Drain to Source Voltage (Vdss)  

30V

Vgs (Max)  

±20V

Fall Time (Typ)  

16 ns

Continuous Drain Current (ID)  

86A

Gate to Source Voltage (Vgs)  

12V

Drain to Source Breakdown Voltage  

30V

Input Capacitance  

2.15nF

Drain to Source Resistance  

5.8mOhm

Rds On Max  

5.8 mΩ

Height  

2.26mm

Length  

6.7056mm

Width  

6.22mm

RoHS Status  

ROHS3 Compliant